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TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

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TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

Name: TIF1003002US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor
Brand: Ziitek
Price: 0.1 USD

Wholesale TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor from china suppliers

Brand Name : Ziitek

Model Number : TIF100-30-02US

Certification : UL and RoHs

Place of Origin : Vietnam

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

Dielectric Breakdown Voltage : >5500VAC

Density : 2.9g/cm³

Application : Semiconductor, Medical Equipment, Mask Aligner

Keywords : Thermal Silicone Pad

Color : Gray

Thermal Conductivity : 3.0W/mK

Hardness : 20 Shore 00

Sample : Free sample

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TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

Ziitek TIF^®100-30-02US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0.

Features:

> Good thermal conductive: 3.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Easy release construction
> Electrically isolating
> High durability

Applications:

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply

Typical Properties of TIF^®100-30-02US Series
Property	Value	Test method
Color	Gray	Visual
Construction & Compostion	Ceramic filled silicone elastomer	******
Specific Gravity	2.9g/cc	ASTM D297
Thickness range	0.020"(0.5mm)~0.200"(5.0mm)	******
Hardness	20 Shore 00	ASTM 2240
Continuos Use Temp	-40 to 160℃	*****
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149
Dielectric Constant	3.8 MHz	ASTM D150
Volume Resistivity(Ohm-cm)	1.0X10¹²	ASTM D257
Flame rating	94 V0	UL E331100
Thermal conductivity	3.0W/m-K	ASTM D5470

Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)

Products Size:

8"*16"(203mm*406mm)
TIF series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF series sheets type can add with fiberglass reinforced.

TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Independent R&D team

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A:1. Click the "Sent messages" button to continue with the process.

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TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

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